View ESD200-B1-CSP0201_8765420.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

power management & multimarket data sheet revision 1.0, 2013-05-21 final ESD200-B1-CSP0201 low clamping voltage tvs diode in a thin 0201 chip scale package ESD200-B1-CSP0201 tvs diode transient voltage suppressor diodes
edition 2013-05-21 published by infineon technologies ag 81726 munich, germany ? 2013 infineon technologies ag all rights reserved. legal disclaimer the information given in this docu ment shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infine on technologies hereby disclaims any and all warranties and liabilities of any kind, including witho ut limitation, warranties of non-infrin gement of intellectua l property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies compon ents may be used in life-su pport devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safe ty or effectiveness of that de vice or system. life support devices or systems are intended to be implanted in the hu man body or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
ESD200-B1-CSP0201 final data sheet 3 revision 1.0, 2013-05-21 trademarks of infineon technologies ag aurix?, bluemoon?, c166?, ca npak?, cipos?, cipurse?, comn eon?, econopack?, coolmos?, coolset?, corecontrol?, crossave?, dave?, easypim?, econobri dge?, econodual?, econopim?, eicedriver?, eupec?, fcos?, hitfe t?, hybridpack?, i2rf?, isoface?, isopack?, mipaq?, modstack?, my-d?, novalithic?, omnitune?, optimos?, origa?, primarion?, primepack?, primestack?, pr o-sil?, profet?, rasic?, re versave?, satric?, sieget?, sindrion?, sipmos?, smarti?, smartlew is?, solid flash?, tempfet?, thinq!?, trenchstop?, tricore?, x-go ld?, x-pmu?, xmm?, xposys?. other trademarks advance design system? (ads) of agilent te chnologies, amba?, arm?, multi-ice?, keil?, primecell?, realview?, thumb?, vision? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus?, firstgps? of trimble navigation ltd. emv? of emvc o, llc (visa holdings in c.). epcos? of epcos ag. flexgo? of microsoft corp oration. flexray? is licensed by flexray consortium. hyperterminal? of hilgraeve incorporated. iec? of commission electrot echnique internationale. irda? of infrared data association corporation. iso? of international organization for standardization. matlab? of mathworks, inc. maxim? of maxim integrated products, inc. microtec?, nucleus? of mentor graphics corporation. mifare? of nx p. mipi? of mipi alliance, inc. mips? of mips technologies, inc., usa. murata? of murata manufacturing co., microwave offi ce? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. open wave? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of sirius sate llite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of sy mbian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. t ektronix? of tektroni x inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilog?, palladium? of cadence design systems, inc. vlynq? of texas instruments inco rporated. vxworks?, wind river? of wind river systems, inc. zetex? of diodes zetex limited. last trademarks update 2010-10-26 revision history: revi sion 0.9.3, 2012-03.13 page or item subjects (major changes since previous revision) revision 1.0, 2013-05-21 all status change to final
ESD200-B1-CSP0201 low clamping voltage tvs diode in a thin 0201 chip scale package final data sheet 4 revision 1.0, 2013-05-21 1 low clamping voltage tvs diod e in a thin 0201 chip scale package 1.1 features 1.2 application examples ? esd protection of highly susceptible ic/asics in audio, headset, human digital interfaces ? dedicated solution to boost space saving and hi gh performance in miniaturized modern electronics 1.3 product description figure 1-1 pin configurati on and schematic diagram ? esd / transient protection of susceptible i/o lines to: ? iec61000-4-2 (esd): 16 kv (air/contact discharge) ? iec61000-4-5 (surge): 3 a (8/20 s)) ? low clamping voltage ? low dynamic resistance: r dyn 0.2 ? typ . ? supports applications with signal voltage between -5.5 v and 5.5 v max. ? line capacitance: c l =6.5pf ? minimized overshoot due to extremely low pa rasitic inductance of chip scale package ? miniature form factor (xy) = 0201 (0.58 mm x 0.28 mm) ? thin 0.15 mm package thickness to allow direct integration into modules ? optimized assembly: its bi directional and symmetric i/v characteristics allow placement on the pcb with no danger of polarity orientation issues table 1-1 ordering information type package configuration marking code ESD200-B1-CSP0201 wll-2-1 1 line, bi-directional a 1) 1) the device does not have any markin g or date code on the device backside. the marking code is on pad side. configuration _schematic_diagram.vst.vsd b) schematic diagram a) pin configuration top view
ESD200-B1-CSP0201 characteristics final data sheet 5 revision 1.0, 2013-05-21 2 characteristics 2.1 maximum ratings attention: stresses above the max. values listed here may cause permanent damage to the device. exposure to absolute maximum rating conditions for extended periods may affect device reliability. maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 2.2 electrical characteristics at t a = 25 c, unless otherwise specified figure 2-1 definitions of electrical characteristics table 2-1 maximum ratings at t a = 25 c, unless otherwise specified parameter symbol values unit min. typ. max. esd 1) contact discharge air discharge 1) v esd according to iec61000-4-2 ( r = 330, c = 150 pf discharge network) v esd -16 -16 - - 16 16 kv peak pulse current ( t p = 8/20 s) 2) 2) i pp according to iec61000-4-5 ( t p = 8/20 s) i pp -3 - 3 a operating temperature range t op -40 - 125 c storage temperature t stg -65 - 150 c

!"
"

!"

ESD200-B1-CSP0201 characteristics final data sheet 6 revision 1.0, 2013-05-21 table 2-2 dc characteristics at t a = 25 c, unless otherwise specified parameter symbol values unit note / test condition min. typ. max. reverse working voltage v rwm -5.5 - 5.5 v breakdown voltage v br 6- 10v i br =1ma reverse current i r -0.1100na v r =5.5v table 2-3 rf characteristics at t a = 25 c, unless otherwise specified parameter symbol values unit note / test condition min. typ. max. line capacitance c l 6.5 pf v r =0v, f =1mhz table 2-4 esd characteristics at t a = 25 c, unless otherwise specified parameter symbol values unit note / test condition min. typ. max. clamping voltage 1) 1) v esd according to iec61000-4-2 ( r =330 ? , c = 150 pf discharge network) v cl -12-v v esd =8kv contact discharge clamping voltage 2) 2) ansi/esdstm5.5.1-electrostat istic discharge sensitivity testing using transmission line pulse (tlp) model. tlp conditions: z 0 =50 , t p = 100 ns, t r = 0.6 ns, i tlp and v tlp average window: t 1 = 30 ns to t 2 = 60 ns, extraction of dynamic resistance using squares fit to tlp characteristics between i tlp1 = 2.5 a and i tlp2 = 17 a. please refer to application note an210 [1] - - 10 13 - - i tlp =1a i tlp =16a clamping voltage 3) 3) i pp according to iec61000-4-5 ( t p =8/20 s) - - 10 12.5 - - i pp =1a i pp =3a dynamic resistance 2) r dyn -0.2- ?
ESD200-B1-CSP0201 typical characteristics final data sheet 7 revision 1.0, 2013-05-21 3 typical characteristics curves specified at t a = 25 c, unless otherwise specified figure 3-1 reverse current: i r = f ( v r ) figure 3-2 reverse current: i r = f ( t a ), v r =5.5v 10 -12 10 -11 10 -10 10 -9 10 -8 10 -7 10 -6 10 -5 10 -4 10 -3 -10 -8 -6 -4 -2 0 2 4 6 8 10 i r [a] v r [v] 10 -1 10 +0 10 +1 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 i r [na] t a [ c]
ESD200-B1-CSP0201 typical characteristics final data sheet 8 revision 1.0, 2013-05-21 figure 3-3 reverse voltage: v br = f ( t a ), i r =1ma figure 3-4 line capacitance: c l = f ( v r ), f =1mhz 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 9 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 v br [v] t a [ c] 0 1 2 3 4 5 6 7 8 9 10 -3 -2.5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 3 c l [pf] v r [v]
ESD200-B1-CSP0201 typical characteristics final data sheet 9 revision 1.0, 2013-05-21 figure 3-5 clamping voltage (tlp): i tlp = f ( v tlp ) according ansi/esdstm5.5.1-electrostatistic discharge sensitivity testing using transmissi on line pulse (tlp) model. tlp conditions: z 0 =50 , t p =100ns, t r =0.6ns, i tlp and v tlp average window: t 1 =30ns to t 2 =60ns, extraction of dynamic resistance using squares fit to tlp characteristics between i tlp1 = 2.5 a and i tlp2 = 17 a. please refer to application note an210 [1] -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30 -20 -15 -10 -5 0 5 10 15 20 -15 -12.5 -10 -7.5 -5 -2.5 0 2.5 5 7.5 10 12.5 15 i tlp [a] equivalent v iec [kv] v tlp [v] ESD200-B1-CSP0201 r dyn r dyn = 0.20 r dyn = 0.20
ESD200-B1-CSP0201 typical characteristics final data sheet 10 revision 1.0, 2013-05-21 figure 3-6 pulse current (iec61000-4-5) versus clamping voltage: i pp = f ( v cl ) -5 -4 -3 -2 -1 0 1 2 3 4 5 -20 -15 -10 -5 0 5 10 15 20 i pp [a] v cl [v] ESD200-B1-CSP0201 r dyn r dyn = 1 r dyn = 1
ESD200-B1-CSP0201 typical characteristics final data sheet 11 revision 1.0, 2013-05-21 figure 3-7 iec61000-4-2: v cl =f ( t ), +8 kv pulse figure 3-8 iec61000-4-2: v cl =f ( t ), -8 kv pulse -5 0 5 10 15 20 25 30 35 40 45 50 -100 0 100 200 300 400 500 600 700 800 900 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = 25 v v cl-30ns-peak = 12 v -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 -100 0 100 200 300 400 500 600 700 800 900 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = -24 v v cl-30ns-peak = -11 v
ESD200-B1-CSP0201 typical characteristics final data sheet 12 revision 1.0, 2013-05-21 figure 3-9 iec61000-4-2: v cl =f ( t ), +15 kv pulse figure 3-10 iec61000-4-2: v cl =f ( t ), -15 kv pulse -5 0 5 10 15 20 25 30 35 40 45 50 -100 0 100 200 300 400 500 600 700 800 900 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = 34 v v cl-30ns-peak = 13 v -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 -100 0 100 200 300 400 500 600 700 800 900 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = -35 v v cl-30ns-peak = -12 v
ESD200-B1-CSP0201 application information final data sheet 13 revision 1.0, 2013-05-21 4 application information figure 4-1 single line, bi-directional esd / transient protection application_ESD200-B1-CSP0201.vsd esd sensitive device 1 2 connector the protection diode should be placed very close to the location where the esd or other transients can occur to keep loops and inductances as sm all as possible . pin 2 (or pin 1) should be connected directly to a ground plane on the board . i/ o protected data line with signal level -5.5 v up to +5 .5 v (bi-directional )
ESD200-B1-CSP0201 package final data sheet 14 revision 1.0, 2013-05-21 5 package figure 5-1 wll-2-1 package outline (dimension in mm) figure 5-2 wll-2-1 footprint (dimension in mm) figure 5-3 wll-2-1 packing (dimension in mm) figure 5-4 wll-2-1 marking (example) 0.27 0.19 0.19 0.19 copper solder mask stencil apertures 0.57 0.24 0.62 0.32 0.24 0.14 2 0.23 sg-wll-2-1-tp v02 0.35 0.21 0.68 8 deliveries can be in embossed tape with or without vacuum hole (no selection possible). specification allows identical processing (pick & place) by users. sg-wll-2-1-mk v01 marking on pad-side type code
ESD200-B1-CSP0201 references final data sheet 15 revision 1.0, 2013-05-21 references [1] infineon ag - application note an210: effective esd protection design at system level using vf-tlp characterization methodology
published by infineon technologies ag www.infineon.com

▲Up To Search▲

Price & Availability of ESD200-B1-CSP0201

	To Download ESD200-B1-CSP0201 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .